ADVANCED COMPONENT LABS, INC.
Capabilities
LAMINATES
  •  High Tg, BT resins
  •  Low Dk, Low Df Formulations
  •  High Strength, Low CTE selections
  •  Polyimide/Kapton
  •  Multi-function FR-4
  •  Min Cladding ¼ oz
  •  Max Cladding 2 oz
  •  Min Thickness .03mm (.0012)

CONSTRUCTIONS
  •  Controlled Dielectrics Thicknesses
  •  Controlled Impedance
  •  Differential Signals
  •  Microstrip and stripline
  •  Build Ups (to 12 Layers)
  •  Blind Vias, Buried Vias
  •  Flex .025mm (.001)
  •  Conductive Hole Plug
  •  “Via in Pad” for RF and High Density substrates
  •  Additive and Subtrative Processes

DRILLING
  •  Mechanical, Laser and Plasma
  •  Min drill hole .025mm (.001)

SURFACE FINISHES
  • Wirebondable Structures
  •  Differential Metalizations
  •  Electrolytic/Electroless Plating
  •  Full Body, Selective and Contact Gold
  •  Immersion Silver

LINE & SPACE
  •  Min Line .015mm (.0006)
  •  Min Space .015mm (.0006)
  •  Finish Trace Tolerances +/-
  •  ¼ oz Int 5%
  •  1 oz Int 15%
SOLDER MASK
  •  Per IPC-SM-840
  •  Taiyo and Conventional Epoxies
  •  Liquid Photo-Imageable and Dry Films
  •  “Flex” Mask

MECHANICAL
  •  Complete COC’s
  •  Cross Section Analysis
  •  Bondability assurance (pull strength and sigma
 analysis)
  •  XRF Analysis
  •  NIST Certified

PREFERRED DATA
  •  Gerber RS274X
  •  DXF, DWG
  •  AutoCAD
  •  Email: acl1@aclusa.com

ENGINEERING SOFTWARE
  • Valor Genesis 2000

ELECTRICAL TEST
  •  High Density Flying Probes
  •  Net List Comparison
  •  AOI

HEATSINK ATTACH
  •  OFHC Copper or 6061-T6 Aluminum
  •  Conductive adhesives with precision tolerances
  •  Cavity Fabrications

LABORATORY
  •  Thermal Stress/Cross Sections
  •  Dielectric Spacing Verification
  •  Plating Process Controls
Wire Bondable Gold Specialist
Quick Turn and Pre-production Manufacturing
ITAR Approved USA Fabricator