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The Power of Three:

ACL USA is now a Silitronics Company

A "World Class" supplier of semiconductor package substrates and high density interconnects

About Us

A Complete Packaging Ecosystem

Our Company Mission

Advanced Component Labs, located in Santa Clara, California, is the USA's leading fabricator of Semiconductor Package Substrates and High Density Interconnects. With a sharp focus directed towards the semiconductor community

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ITAR Approved USA Fabricator

Quick Turn and Pre-production Manufacturing

High Layer Count Substrates & HDI

Our Products

Ball Grid Arrays

Ball Grid Array substrates are designed for reliable, high-I/O semiconductor packaging where electrical performance, routing density, and manufacturability all matter.

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Chip Scale Packages

Chip Scale Package substrates help designers reduce footprint while maintaining strong electrical and thermal performance in compact devices.

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Flip Chips

Flip chip substrates are built for high-density interconnection, short signal paths, and improved electrical performance in advanced semiconductor packages.

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High Density Interposers

High density interposers provide the fine-pitch routing needed to connect complex devices in advanced packaging architectures.

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Capabilities

Built for Advanced Substrate Requirements

From controlled dielectric builds to fine line geometry, mechanical analysis, electrical test and laboratory verification, our capabilities support demanding semiconductor package substrate programs.

Laminates & Constructions

High Tg materials, controlled impedance, microstrip, stripline, build ups and RF substrates.

Drilling & Surface Finishes

Mechanical, laser and plasma drilling with wirebondable structures and selective gold finishes.

Mechanical & Test

COC's, cross sections, XRF analysis, high density flying probes, AOI and net list comparison.

Contact Us

End-to-end advanced semi-conductor and silicon photonics packaging services.