Ball Grid Arrays
Ball Grid Array substrates are designed for reliable, high-I/O semiconductor packaging where electrical performance, routing density, and manufacturability all matter.
Learn MoreA "World Class" supplier of semiconductor package substrates and high density interconnects
Advanced Component Labs, located in Santa Clara, California, is the USA's leading fabricator of Semiconductor Package Substrates and High Density Interconnects. With a sharp focus directed towards the semiconductor community
Read MoreFrom controlled dielectric builds to fine line geometry, mechanical analysis, electrical test and laboratory verification, our capabilities support demanding semiconductor package substrate programs.
High Tg materials, controlled impedance, microstrip, stripline, build ups and RF substrates.
Mechanical, laser and plasma drilling with wirebondable structures and selective gold finishes.
COC's, cross sections, XRF analysis, high density flying probes, AOI and net list comparison.


End-to-end advanced semi-conductor and silicon photonics packaging services.