Capabilities

Advanced Package Substrate Capabilities

Laminates

  • High Tg, BT resins
  • Low Dk, Low Df Formulations
  • High Strength, Low CTE selections
  • Polyimide/Kapton
  • Multi-function FR-4
  • Min Cladding 1/4 oz
  • Max Cladding 2 oz
  • Min Thickness .03mm (.0012)

Constructions

  • Controlled Dielectrics Thicknesses
  • Controlled Impedance
  • Differential Signals
  • Microstrip and stripline
  • Build Ups (to 12 Layers)
  • Blind Vias, Buried Vias
  • Flex .025mm (.001)
  • Conductive Hole Plug
  • "Via in Pad" for RF and High Density substrates
  • Additive and Subtractive Processes

Drilling

  • Mechanical, Laser and Plasma
  • Min drill hole .025mm (.001)

Surface Finishes

  • Wirebondable Structures
  • Differential Metalizations
  • Electrolytic/Electroless Plating
  • Full Body, Selective and Contact Gold
  • Immersion Silver

Line & Space

  • Min Line/ Space 15um / 15um
  • Finish Trace Tolerances +/-
  • 1/2 oz Int 5%
  • 1 oz Int 15%

Solder Mask

  • Per IPC-SM-840
  • Taiyo and Conventional Epoxies
  • Liquid Photo-Imageable and Dry Films
  • "Flex" Mask

Mechanical

  • Complete COC's
  • Cross Section Analysis
  • Bondability assurance (pull strength and sigma analysis)
  • XRF Analysis
  • NIST Certified

Preferred Data

Engineering Software

  • Valor Genesis 2000

Electrical Test

  • High Density Flying Probes
  • Net List Comparison
  • AOI

Heatsink Attach

  • OFHC Copper or 6061-T6 Aluminum
  • Conductive adhesives with precision tolerances
  • Cavity Fabrications

Laboratory

  • Thermal Stress/Cross Sections
  • Dielectric Spacing Verification
  • Plating Process Controls