Advanced Component Labs, located in Santa Clara, California, is the USA's leading fabricator of Semiconductor Package Substrates and High Density Interconnects. With a sharp focus directed towards the semiconductor community; our
Flip Chip, BGA, MCM, SIP and Multi-Layer Organic Interposer fabrications
offer a perfect response to the market's constantly increasing need for shorter lead times and improved device performance.
We offer ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer. Our current process capabilities include 12um circuit geometries, 20um dielectric layers, 50um laser vias and 110um bump pitch processing. These process capabilities combined with a strong comprehension of high speed digital and high frequency RF package requirements allows ACL to make a significant impact in reducing a program's "time to market" equation.
By selecting ACL, you will be choosing a US manufacturing operation as well as an organization with more than 40 years experience in the fabrication of organic substrates. We guarantee that your devices will be delivered on time and fabricated precisely to your design requirements.
