Our Substrates
High density, high reliability product support for semiconductor package substrates and interconnect applications.
Ball Grid Array substrates are designed for reliable, high-I/O semiconductor packaging where electrical performance, routing density, and manufacturability all matter. ACL's quick-turn U.S. fabrication supports demanding BGA programs with fine geometries, advanced vias, and production-ready quality for faster time to market.
Chip Scale Package substrates help designers reduce footprint while maintaining strong electrical and thermal performance in compact devices. ACL builds CSP solutions for space-constrained applications that need precision fabrication, fast response, and dependable substrate quality.
Flip chip substrates are built for high-density interconnection, short signal paths, and improved electrical performance in advanced semiconductor packages. ACL supports flip chip programs with fine line capability, laser via processing, and quick-turn manufacturing for performance-driven designs.
High density interposers provide the fine-pitch routing needed to connect complex devices in advanced packaging architectures. ACL manufactures organic interposer solutions with tight geometries and controlled constructions to support compact, high-performance semiconductor designs.
Build-up substrates enable multilayer routing density by adding sequential dielectric and conductor layers for more complex package designs. ACL's build-up capability supports advanced packaging requirements with controlled dielectric structures, blind and buried vias, and rapid fabrication cycles.
High-speed digital substrates are engineered to maintain signal integrity in packages handling fast data rates and dense interconnect structures. ACL supports these applications with controlled dielectric thicknesses, differential signal capability, and a strong understanding of signal-sensitive package design.
High-frequency RF substrates are built for applications where low loss, controlled performance, and stable material behavior are essential. ACL offers RF-focused substrate fabrication using controlled impedance structures, low Dk and low Df materials, and precision processes suited for demanding frequency ranges.
Controlled impedance substrates are critical for maintaining predictable electrical behavior in high-speed and RF package designs. ACL manufactures these constructions with tightly managed dielectric thicknesses, trace geometries, and process control to support consistent signal performance.
Thermal via structures help move heat away from active devices to improve reliability and overall package performance. ACL designs and fabricates thermal-management features that support enhanced heat transfer in high-power and high-density semiconductor applications.
Specializing in developing custom semiconductor and photonic packaging processes tailored for multi-chiplet SiP, heterogeneous integration, and ultra-high-speed interconnects.
Multi-chip module substrates bring multiple devices together in one compact package to improve integration, signal performance, and space efficiency. ACL supports MCM programs with high-density routing, controlled constructions, and fast-turn capability for complex semiconductor assemblies.